Al2O3 - Sapphire Wafer, R Plane, 100mm dia x 0.525mm, 2SP - ALR100D0525S2US

Al2O3 - Sapphire Wafer, R Plane, 100mm dia x 0.525mm, 2SP - ALR100D0525S2USFearures: Monocrystalline Sapphire Wafer Purity> =99. 995% Wafer size: 100 mm dia x 0. 525 mm+ 25um thickness Orientation: R plane (1102) + 0. 2 deg Orientaion Flat: 31 + 2. 5 mm Primary Flat Location: Projected C Axis 45 + 2 degree Surface Roughness: Ra <= 3 Angstrom Two sides polished Edge Chamfering: Ground with 45 degree chamfering Bow: <= 20um Laser Mark: none Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with

Gauge Pressure Value to Force Conversion

Various graphs and curves can be created by software based on user definition

MTI supplies high quality sintered diamond blades for precision cutting or dicing of various crystals and crystalline oxides

Polished surface: Wafer surface is EPI polished via a special CMP procedure

Wafer size: 10 mm x 5 mm  x 0

Vacuum Pump: 110VAC or 220VAC please select the voltage in the options bar (10A fuse)

Material LiCoO2 Coated on Aluminum Foil

Compliance Vacuum gauge is ETL certified

Case Material: Made of 11 gauge (3mm thickness) 304 stainless steel sheet with the support frame

Coin Cell Assembling

5 " Blade Dia 6" Thickness 0

it can grind samples under the vacuum condition or be filled with inert gas